Job description:
- Our vision is to transform how the world uses information to enrich life. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
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Qualifications:
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- Bachelors or advanced degree in Electrical or Mechanical Engineering with significant technical experience
- Minimum 2+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must
- Minimum 2+ years’ experience in packaging area including Wirebond & Flip chip technologies.
- Experience preferred in schematic capture, layout and design using Cadence Allegro Schematic Design Entry (Concept HDL) design tools is required
- Proficient in AutoCAD 2D and 3D (Inventor a plus)
- Ability to travel internationally as required
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Responsibilities:
Create Package Designs
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- Execute advanced package design reviews in a timely and efficient manner
- Design for optimum electrical performance, manufacturability, and package reliability
- Perform direct design reviews with assembly subcon design teams
- Participate in the DFMEA (Design for Manufacturing) process
Generate Documentation
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- Maintain familiarity with documentation work flows and signoff flows
- Ensure accurate and timely update of all documents into the Assembly Database
- Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc.
- Provide accurate drafting support for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
